ANDTech Focus on wireless module and hardware solution for 15 years.
1> FPCB Processing Details:
Place of Origin Shenzhen&Hongkong China | Brand Name: winscon-FPC | Model Number: 2 layers pcb |
Base Material:PI | Copper Thickness: 1/3oz | Board Thickness: 0.5mm |
Min. Hole Size:0.2mm | Min. Line Width: 0.06mil | Min. Line Spacing: 0.06mil |
Surface Finishing: HASL,OSP ( Lead Free ) | Soldermask: gold | Legend: White |
Test: E-testing. |
Packing details: | vacuum packing, export carton |
Delivery time: | 3-7 days. |
Item | Producing Capability |
Layers | 1-20(Including Rigid and Flexible Circuit) |
Panel Size | Max:250*550(mm) |
Drilling Diameter | Max.Diameter:6.5mm(256mil) Min.Diameter:0.20mm(8mil) |
Base Material Copper Thickness | Max:3 oz Min:1/3 oz |
Insulating Layer Thickness | Max:0.05mm(PI)(2mil). Min:0.0125mm(PI)(0.5mil) |
Electroplating Sn/Pb Thickness | 3μm---20μm |
Electroplating Au Thickness | Au:≥0.05μm Ni:1μm-5μm |
Chemical Immersion Ni/Au Thickness | 0.05μm----0.1μm |
Electroplating Sn Thickness | 3μm---20μm |
Erching Line Width & Space | S/S:2.5mil(0.06mm) D/S:2.5mil(0.06mm) |
Etching Tolerance | Width:±20% Special Width:±10% |
Outline Tolerance(from side to side) | ±0.05mm(±2mil) |
Parts Fixed Position Tolerance | ±0.2mm(8mil) |
Product Catalog Surface Finish | 1.Electrical/Immersion Ni&Au Plating Board 2.Electrical/Immersion Tin Plating Board 3.OSP Board |