ANDTech Focus on wireless module and hardware solution for 15 years.
Item | Manufacture Capability |
Board Material | FR-4 |
Layer | 1-20 |
Finished Board thickness | 0.2 mm-3.8mm ( 8 mil-150 mil ) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5 OZ--2.0OZ |
Impedance Control | YES |
Hole tolerance | PTH:±0.075mm NPTH: ±0.05mm |
Min drilled Hole size | 0.15mm(6mil) |
Min Laser hole size | 0.1mm(4mil) |
Min Space Width | 0.075mm (3 mil) |
Min Trace Width | 0.075mm(3mil) |
BGA Pitch | 0.2 mm (8 mil) |
Solder mask Color | Green , Red , Blue , Black , White |
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
Surface finish/treatment | HASL/HASL lead free , Immersion Gold |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate. |